Samsung Electro-Mechanics Co Ltd
Information Technology
Current price
Target price 00%
Ranks rating
76
Position in sub-industry
333 / 676
Position in country
1525 / 2780
Return on Assets, %
4
2.5
Net income margin, %
2.1
2.5
EBITDA margin, %
12.9
9.8
Debt to Equity, %
20.3
30.1
Intangible assets and goodwill, %
1.2
0.9
Revenue CAGR 3Y, %
4.7
5.5
Total Equity change 1Y, %
1.4
-0.7
Revenue Y, % chg
-7.1
-10
P/E
27.6
26.4
P/BV
1.4
1.7
P/S
1.3
1.6
EV/S
1.3
1.7
EV/EBITDA
8.2
11.7
Average Analyst recommendation
Buy
Buy
Average upside forecasts, %
14.1
26.5
Forward P/E
17.2
16.2
Dividend Yield, %
0.7
2.1
Forward Dividend Yield, %
0
0
Expected dividend per share
1.4
0
Payout Ratio, %
36.8
39
Dividend Ex Date
2023-12-27
Competitors
Ranks
-
SoluM Co Ltd
00%
-
LG Innotek Co Ltd
00%
-
Samsung SDI Co Ltd
00%
-
Daeduck Electronics Co Ltd
00%
-
Samsung Electro-Mechanics Co Ltd
00%
-
Isu Petasys Co Ltd
00%
-
Daejoo Electronic Materials Co Ltd
00%
-
Lotte Energy Materials Corp
00%
-
LG Display Co Ltd
00%
-
Solus Advanced Materials Co Ltd
00%
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Company information
Country
Korea; Republic (S. Korea)
Sector
Information Technology
Industry group
Technology Hardware & Equipment
Industry
Electronic Equipment, Instruments & Components
Sub-sector
Information Technology
Capitalization (millions of $)
8776
Ticker
009150.KS
ISIN
KR7009150004
IPO date
1979-02-27
Availability on Russian exchanges
No
Reporting for
2024-02-23
Date fact. publication of reports
2023-12-31
Company Description
Samsung Electro-Mechanics Co Ltd is a Korea-based company mainly engaged in the manufacture and distribution of electronic components. The Company operates its business through three segments. The Component Solution segment is involved in the production and sale of passive elements such as multi layers ceramic capacitors (MLCC), inductors, chip resistors. The Module Solution segment is involved in the production and sale of module products, including camera modules and communication modules. The Board Solution segment is involved in the production and sale of semiconductor package substrates and high-density multilayer boards. The Company distributes its products in domestic and overseas markets such as America, Europe and Southeast Asian countries, China and Japan.
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