Amkor Technology Inc

• Country

  United States of America

• Sector

  Information Technology

• Industry group

  Semiconductors & Semiconductor Equipment

• Industry

  Semiconductors & Semiconductor Equipment

• Sub-sector

  Information Technology

• Capitalization (millions of $)

  7959.5

• Ticker

  AMKR.O

• ISIN

  US0316521006

• IPO date

  1998-05-01

• Availability on Russian exchanges

  Yes

• Reporting for

  2024-02-16

• Date fact. publication of reports

  2023-12-31

Amkor Technology, Inc. is a providers of outsourced semiconductor packaging and test services. The Company’s packaging and test services are designed to meet application and chip specific requirements, including the required type of interconnect technology; size; thickness; and electrical, mechanical and thermal performance. It provides turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The semiconductor manufacturing process consists of Integrated circuit (IC) design, wafer fabrication, wafer probe, packaging and final test. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. IDMs generally design, manufacture, package and test semiconductors in their own facilities.