BE Semiconductor Industries NV

• Country

  Netherlands

• Sector

  Information Technology

• Industry group

  Semiconductors & Semiconductor Equipment

• Industry

  Semiconductors & Semiconductor Equipment

• Sub-sector

  Information Technology

• Capitalization (millions of $)

  12522.4

• Ticker

  BESIY.PK

• ISIN

  US0733201034

• IPO date

  1995-12-04

• Availability on Russian exchanges

  No

• Reporting for

  2024-03-01

• Date fact. publication of reports

  2023-12-31

BE Semiconductor Industries N.V. (Besi) is a holding company. The Company is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. It operates through three segments: Die Attach, Packaging and Plating. It develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial and solar energy. The Company offers products, such as Die attach equipment, which include single chip, multi-chip, multi module, flip chip, thermo-compression bonding (TCB) and enhanced wafer level ball grid array (eWLB) die bonding systems, and die sorting systems; Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals.