Disco Corp

JP

DISCP

Information Technology

30.93 ₽

Current price

Hold
30.93 ₽

Target price 00%

Ranks rating

76

  • Position in sub-industry

    115 / 375

  • Position in country

    2490 / 4811

  • Return on Assets, %

    15.9

    4.4

  • Net income margin, %

    20.8

    7.8

  • EBITDA margin, %

    43.1

    14.2

  • Debt to Equity, %

    0

    25.6

  • Intangible assets and goodwill, %

    0

    1.2

  • Revenue CAGR 3Y, %

    26.2

    11

  • Total Equity change 1Y, %

    6.4

    2.5

  • Revenue Y, % chg

    -4.7

    -8.4

  • P/E

    82.1

    30.1

  • P/BV

    16.5

    2.3

  • P/S

    21.6

    2.8

  • EV/S

    20.9

    2.8

  • EV/EBITDA

    50.4

    15.9

  • Average Analyst recommendation

    Hold

    Hold

  • Average upside forecasts, %

    882.3

    23

  • Forward P/E

    49.7

    21

  • Dividend Yield, %

    2.5

    1.2

  • Forward Dividend Yield, %

    9.1

    0

  • Expected dividend per share

    3.2

    0.1

  • Payout Ratio, %

    41.7

    19.6

Get an analytical review of this company

Competitors

Ranks

  • Advantest Corp

    00%

  • Lasertec Corp

    00%

  • Rorze Corp

    00%

  • Disco Corp

    00%

  • Tokyo Electron Ltd

    00%

  • Screen Holdings Co Ltd

    00%

  • Sumco Corp

    00%

  • Tokyo Seimitsu Co Ltd

    00%

  • Ulvac Inc

    00%

  • Kokusai Electric Corp

    00%

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Company information

  • Country

    Japan

  • Sector

    Information Technology

  • Industry group

    Semiconductors & Semiconductor Equipment

  • Industry

    Semiconductors & Semiconductor Equipment

  • Sub-sector

    Information Technology

  • Capitalization (millions of $)

    39790.9

  • Ticker

    DSCSY.PK

  • ISIN

    US25461D1000

  • IPO date

    1999-12-07

  • Availability on Russian exchanges

    No

  • Reporting for

    2024-01-30

  • Date fact. publication of reports

    2023-12-31

Company Description

DISCO CORPORATION is a Japan-based company mainly engaged in the manufacture and sale of semiconductor manufacturing devices and precision processing tools, as well as the maintenance and related services business. The Company is engaged in the provision of dicing saws, laser saws, grinders, polishers, surface planers and other precision processing equipment, as well as dicing blades, grinding wheels, dry polishing wheels, grindstones for grinding and cutting and other precision processing tools.

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