ASM International NV
Information Technology
Current price
Target price 00%
Ranks rating
76
Position in sub-industry
35 / 375
Position in country
29 / 223
Return on Assets, %
18.6
4.4
Net income margin, %
14.3
7.8
EBITDA margin, %
28.6
14.2
Debt to Equity, %
0.7
25.6
Intangible assets and goodwill, %
24.2
1.2
Revenue CAGR 3Y, %
25.6
11
Total Equity change 1Y, %
21
2.5
Revenue Y, % chg
12.8
-8.4
P/BV
12.5
2.3
EV/EBITDA
27.6
15.9
Dividend Yield, %
0.4
1.2
Forward Dividend Yield, %
0.6
0
Expected dividend per share
3.8
0.1
Payout Ratio, %
32.8
19.6
Dividend Ex Date
2024-05-15
Competitors
Ranks
-
ASM International NV
00%
-
Applied Materials Inc
00%
-
Advantest Corp
00%
-
BE Semiconductor Industries NV
00%
-
ASML Holding NV
00%
-
Disco Corp
00%
-
KLA Corp
00%
-
Tokyo Electron Ltd
00%
-
Teradyne Inc
00%
-
Lam Research Corp
00%
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Company information
Country
Netherlands
Sector
Information Technology
Industry group
Semiconductors & Semiconductor Equipment
Industry
Semiconductors & Semiconductor Equipment
Sub-sector
Information Technology
Capitalization (millions of $)
30987.9
Ticker
ASMIY.PK
ISIN
USN070451026
IPO date
1981-01-01
Availability on Russian exchanges
No
Reporting for
2024-03-01
Date fact. publication of reports
2023-12-31
Company Description
ASM International N.V. is a supplier of wafer processing equipment, primarily for semiconductor manufacturing industry. The Company designs, manufactures and sells equipment and services to its customers for the production of semiconductor devices, or integrated circuits (ICs). The Company operates in two segments, which include Front-end and Back-end. The Front-end segment manufactures and sells equipment used in wafer processing, encompassing the fabrication steps in which silicon wafers are layered with semiconductor devices. The front-end segment includes manufacturing, service, and sales operations in Europe, the United States, Japan and South East Asia. The Back-end segment manufactures and sells equipment and materials used in assembly and packaging, encompassing the processes in which silicon wafers are separated into individual circuits. The Company supplies equipment to the manufacturers of analog semiconductor devices primarily for the deposition of thin films.
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